Heat Sink Compound Syringe - 20g
Stock No: 3017325OH
Product Description
Heat Sink Compound Syringe - 20g
The Kontakt Chemie Heat Sink Compound is a high-performance thermal paste that improves heat transfer between electronic components. It has excellent moisture resistance and low metallic impurity content, making it ideal for a wide range of applications.
Application:
- Printed circuit boards
- Electronic components
- Control assemblies
Directions:
- Apply it to a clean, dry surface.
- Do not mix with other products.
- Do not use on energized equipment.
Specification:
- Capacity: 20g
- High thermal conductivity
- Excellent moisture buffer
- Low metallic impurity content
- Operating temperature: -50°C to 300°C
Manufacturers Part Number
- 1031241
EAN
- 5412386071409
The manufacturer of this product has provided additional information that you may find useful regarding the safe use of this product and any necessary precautions you should be aware of. Full details are available in the downloadable PDF.
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